Riga Chip Summit 2026

Wednesday 13. May at 08:30 - 17:00

VEF Kamerzāle Spīdola, Rīga

Riga Chip Summit 2026 is the first chip dedicated summit in Latvia organised by the Latvian Chip Competence Centre (LCCC). The summit will bring together stakeholders from industry, academia, finance, competence centres, start-ups, and SMEs from the Nordic–Baltic region and the wider European ecosystem.

13 May 2026 8:30–17:00

Riga, Latvia at the VEF Kamerzāle Spīdola.

The working language of the forum is English.

The event aims to explore opportunities, pathways, and challenges related to advancing chip business ideas within the Chips Joint Undertaking (Chips JU) framework and to provide companies with a clear overview of the EU microchip ecosystem and the support mechanisms available through Chips JU. It provides a platform for knowledge exchange and shared learning while encouraging international collaboration. The summit also encourages business collaboration through matchmaking sessions and networking opportunities designed to help participants build new partnerships.

Additionally, the summit helps companies better understand pilot project requirements, technology readiness levels (TRL), co-funding structures, intellectual property considerations, and the pathway toward commercialisation. Through start-up showcases, success stories, and university involvement, the event demonstrates that entering the microchip sector is achievable for SMEs and startups across the Baltic-Nordic region and wider Europe.

The event is organized by LCCC and co-organized by Latvijas Mobilais Telefons (LMT), Estonian Chips Competence Centre (KIIP) and Chips Competence Centre Lithuania (Chips C2-LT).

If you have any questions regarding the forum, please contact Jānis at Janis.Sperga_1@rtu.lv!